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端侧AI推动半导体超级周期,三星2028年前追加晶圆厂计划受关注
发布: · 来源: hankyung.com

一句$话总结: 韩国经济新闻5月12日报道,KIW 2026显示端侧AI普及正推高HBM需求,并加剧DRAM、NAND等通用存储供应紧张。
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据韩国经济新闻报道,由韩国经济新闻社与三星证券共同主办的“韩国投资周(KIW)2026”于2026年5月12日在首尔新罗酒店开幕。当天,投资者关注焦点集中在引领韩国股市的半导体企业业务战略上。三星电子半导体DS部门副社长金泰佑表示,随着端侧AI设备大众化,需求正集中到高带宽存储器(HBM),DRAM、NAND等通用存储器供应短缺现象将持续。他还表示,三星将于2028年前建设追加晶圆厂,并强化研发。AI半导体初创企业Rebellions代表朴星炫称,半导体是韩国当前最具优势的领域,并提到其芯片能源和电力效率比英伟达高五倍。全球机构投资者和韩国国内投资专家约1000人出席了活动。来源: hankyung.com
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